|Current Rating||20 A|
|Voltage||220 - 240 V|
|Current Rating||20-400 A|
|Surface Finish||Powder Coated|
|Voltage||230 - 440 V|
The Danfoss power stack is a high-quality power conversion assembly and is a major building block in any larger power conversion system. The assembly comprises of stacked and customized IGBTs (insulated-gate bipolar transistors), which gives power system suppliers the opportunity for unique performance parameters, differentiating their products from their competitors'.
Tailored to your needs. Built to last.
For decades, Danfoss has been helping the world’s largest power system suppliers meet stringent reliability, life-time and cost targets by designing, developing, and manufacturing customized power stacks with the overall goal of optimizing system costs, to deliver competitive advantage.
We design our power stacks according to your individual mission profile – from the individual semiconductors that are used in the power modules, to the mechanical dimensions of the power stack and the control functions to be implemented.
With the average lifespan of a power conversion system being 15–20 years, reliability, flexibility (input and output) and efficiency of power stacks are vital. Wind turbine generators and solar parks operate 24/7 and are exposed to extreme weather conditions. This calls for rugged equipment designed for heavy loads and high performance. At Danfoss you instantly benefit from years of expertise in power modules, thermal management, manufacturing and testing of power conversion equipment.
Using a modular design approach, the power stacks are customized to the specific mission profile of your application in a cost-effective manner.
Choosing a custom-made power stack design offers multiple advantages over standard products:
|Voltage||100 - 500 V|
|Temperature Range||-10 to +50 Degree C|
For over three decades, Danfoss has been helping top-tier manufacturers and system suppliers meet stringent reliability, design and cost targets by developing customized IGBT power modules for tomorrow's e-mobility, energy and industrial applications.
Technology and innovation are more than just buzzwords. Being a market leader in packaging of power semiconductors, we have developed a second-to-none portfolio of tried and tested packaging technologies that address the most challenging aspects of advanced power electronics:
About Danfoss Bond Buffer®
Increase power density without derating the current - while actually improving reliability and prolonging the lifetime of the module. Danfoss Bond Buffer® is a breakthrough in bonding and joining technology that helps you raise the bar for system performance. Our patented DBB® concept is based on an innovative combination of copper wire bonding and sintered die attach that replaces traditional solder joints.
DBB® technology enables power cycling capabilities that are 15 times higher than those seen in aluminum wire bonded power modules. This permits an operation at higher junction temperatures without the need for current derating. This increased power cycling capability makes it possible to optimize the dimensioning of the semiconductor area to increase the cost-effectiveness of the solution.
About Shower Power:
Smart and efficient thermal management is an essential part of the Danfoss technology portfolio allowing us to deliver higher system performance. Offering highly efficient direct liquid cooling, our patented ShowerPower® concept utilizes several meandering cooling channels to guide the coolant along the baseplate. This design improves thermal performance by creating a swirl effect in the cooling channels. This means that the coolant is constantly brought into contact with the surface that requires cooling. The concept almost doubles the effective heat transfer coefficient, to enable much higher current carrying capability.
About transfer moulding:
Multiple applications such as electric drivetrains operating under demanding conditions benefit from our unique transfer molded packaging design. Sealed and protected against vibrations and humidity, the inverter provides
stable and reliable performance - even when subjected to mechanical shocks and damp environments.
Transfer molding in combination with our bond buffer technology allows for more extreme temperature cycling and higher junction temperatures to increase power density.